Development history
- 2019
- Expand new assembly plant, Increase SMT equipment, Increase monthly output
- 2018
- Expand the wafer testing department and introduce automated testing
- 2017
- The newly established assembly factory was put into mass production of UDP and TF cards
reached cooperation with Netac.
- 2016
- Certified by apple MFI
- 2014
- Awarded the national high and new technology enterprise
- 2013
- Undertake the business of SMT processing, wafer testing services
USB finished products OEM/ODM one-stop service
- 2012
- Established the probe card department, and successfully introduced SSD production
participate in the 112th autumn Canton fair
- 2011
- Awarded best supplier by Romas
- 2010
- Attend CES exhibition
start long-term cooperation with Romas of South Korea
- 2009
- Participated in CES Cebit exhibition and Berlin ZFA exhibition
set up branch factory in March
- 2008
- Developed pen and card shaped USB disk
attend ZFA exhibition in Berlin
- 2007
- APEXTO Electronics Co., Ltd. got theright to import and export.
Introduced wafer testing equipment, started to involve in the flash upstream wafer field
- 2006
- Incorporated Shenzhen Apexto Electronics Co., Ltd.-November-
- 2005
- Incorporated Apexto Electronics Co., Ltd. In Hongkong with office operated in free trade zone -April-
Relocated 1st Plant to BaoYuan Road, XiXIang, BaoAn District Shenzhen -August-
- 2004
- Developed and launched own debugging emulators for Hitachi renesas flash memory
- 2003
- Elaborated on Moonlight Treasure Box MP3 Player for USB 2.0 Project
- 2002
- Launched the 1st very own designed USB drive 1.1 OTi 6808 –May-
Marketed 2nd style USB drive -December-